a, according to the mechanical rigidity of the copper clad laminate is divided into rigid clad laminate and flexible clad laminate;
b. According to the insulation material and structure of the copper clad laminate, the structure is divided into organic resin clad laminates, metal-based clad laminates, and ceramic-based clad laminates;
c. According to the thickness of the copper clad plate, it can be divided into thick plate (thickness range 0.8-3.2mm (including Cu)) and thin plate (thickness range smaller than 0.78mm (excluding Cu));
d. According to the reinforcement material of the copper clad laminate, it is divided into glass cloth base copper clad laminate, paper base clad laminate, composite base clad laminate (CME-1, CME-2).
e. Divided into flame-retardant plates and non-fire-retardant plates according to the flammability rating
f. Divided into high Tg board (Tg≥170°C), high dielectric performance board, high CTI board (CTI≥600V), environment-friendly copper clad plate (halogen-free and non-antimony), and ultraviolet light according to certain properties of copper clad laminates. Covered copper clad laminates.
Composition of CCL
The performance requirements of CCL can be summarized in the following six requirements:
1. Appearance requirements
Such as: metal foil surface pits, scratches, resin points, folds, pinholes, bubbles, white silk and so on.
2. Size requirements
Such as: length, width, diagonal deviation, warpage and so on.
3. Electrical performance requirements
Including: dielectric constant (Dk), dielectric loss tangent (Df), volume resistance, surface resistance, insulation resistance, arc resistance, dielectric breakdown voltage, electrical strength, compared to tracking index (CTI), ion resistance Mobility (CAF) and so on.
4. Physical performance requirements
Including: dimensional stability, peel strength (PS), bending strength, heat resistance (thermal stress, Td, T260, T288, T300), punching properties.
5. Chemical performance requirements
Including: flammability, weldability, chemical resistance, glass transition temperature (Tg) Z-axis thermal expansion coefficient (Z-CTB), dimensional stability, etc.
6. Environmental performance requirements
Including: water absorption, pressure vessel cooking test, etc.
CCL standard: IPC-4101C
CCL test standard: IPC-TM-650
PP cutting → pre-folding → combination → pressing → disassembling → inspection → packing → warehousing → shipping
The CCL is an extremely important basic material for printed circuit boards. Various types of printed circuit boards with different functions are selectively processed, etched, drilled and copper-plated on the CCL. Different printed circuits (single-sided, double-sided, multi-layered).
The copper clad laminate is used as the substrate material in the manufacture of the printed circuit board. The printed circuit board mainly serves as the interconnection conduction, insulation and support, and has a great influence on the signal transmission speed, energy loss and characteristic impedance in the circuit. Therefore, the performance, quality, manufacturing processability, manufacturing level, manufacturing cost, and long-term reliability and stability of the printed circuit board depend to a large extent on the CCL.
The copper clad laminates are mainly used to manufacture printed circuit boards for supporting and interconnecting and insulating electronic components. They are called important basic materials for printed circuit boards. It is all electronic products, including aviation, aerospace, remote sensing, telemetry, remote control, communications, computers, industrial controls, household appliances, and even advanced children's toys and other electronic products, are indispensable important electronic materials. With the continuous improvement of the level of science and technology, in recent years some special electronic copper clad laminates are also used to directly manufacture printed electronic components.
Because of the small size, light weight, and thinness of electronic products, it is necessary to force printed circuit boards to have a variety of high-quality and high-tech features, so that the printed circuit board manufacturing technology directly involves a variety of high-tech technologies. Its main and most important Materials - CCL, it must also have a variety of high-quality and high-tech features.
Therefore, the status of CCL in the electronic information industry becomes more and more important.
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