The JEDEC Solid State Technology Association, the leading standard-setting body in the global microelectronics industry, has recently released an important update to the JESD9B "Microelectronics Packaging and Capping Inspection Standards." This updated version can be downloaded free of charge from the JEDEC website.
The purpose of this standard is to verify the process and requirements of microelectronics packages and covers (caps) when manufacturing hybrid microelectronics/microcircuits. It is suitable for the final inspection of the microcircuits from the incoming inspection of the packaged parts to the completion of the packaging manufacturers and microcircuit manufacturers. The JESD9B standard will also replace and include the rewritten JESD27 standard - "Microelectronic Packaging Ceramic Packaging Specification". In addition, the JESD9B standard also includes all relevant areas of the MIL-STD-883 standard and the "Test Method 2009: Appearance" standard. It is designed to work with these standards without conflict.
The JESD9B standard has added new standards based on the technological progress of the packaging industry and the history of user failure modes, and has also updated the old standards, both for the purpose of improving the quality of the appropriate standards, and also to appropriately lower the standards according to the history of use. The standard also includes clear and easy-to-read color photographs or views of the various conditions listed.
“This update standard is the result of numerous collaborations between metal and ceramic package manufacturers, hybrid/microcircuit/semiconductor manufacturers, and aerospace/aviation/military and commercial users.†VPT’s chief operating officer and responsible for updating this Standard JC-13.5 Working Group Leader Shawn? Graham pointed out. "We believe that the release of the JESD9B standard will be welcomed by all manufacturers and users. They will all benefit from having a common reference point for these key test standards."
The purpose of this standard is to verify the process and requirements of microelectronics packages and covers (caps) when manufacturing hybrid microelectronics/microcircuits. It is suitable for the final inspection of the microcircuits from the incoming inspection of the packaged parts to the completion of the packaging manufacturers and microcircuit manufacturers. The JESD9B standard will also replace and include the rewritten JESD27 standard - "Microelectronic Packaging Ceramic Packaging Specification". In addition, the JESD9B standard also includes all relevant areas of the MIL-STD-883 standard and the "Test Method 2009: Appearance" standard. It is designed to work with these standards without conflict.
The JESD9B standard has added new standards based on the technological progress of the packaging industry and the history of user failure modes, and has also updated the old standards, both for the purpose of improving the quality of the appropriate standards, and also to appropriately lower the standards according to the history of use. The standard also includes clear and easy-to-read color photographs or views of the various conditions listed.
“This update standard is the result of numerous collaborations between metal and ceramic package manufacturers, hybrid/microcircuit/semiconductor manufacturers, and aerospace/aviation/military and commercial users.†VPT’s chief operating officer and responsible for updating this Standard JC-13.5 Working Group Leader Shawn? Graham pointed out. "We believe that the release of the JESD9B standard will be welcomed by all manufacturers and users. They will all benefit from having a common reference point for these key test standards."
Power Amplifier,Portable Power Amplifier,Audio Power Amplifier
Maikesen Technology Co., Ltd. , http://www.sz-speaker.com