At present, "Made in China" plays an important role in the global electronics industry. It will undertake new development opportunities in the consumer electronics market, and the electronic manufacturing industry will show more strength. Recently, Huang Junrong, general manager of DEK Greater China Electronics Assembly Department, told reporters of Huaqiang Electronics that with the overseas manufacturing factories transferring to the mainland, there is an unlimited opportunity for electronics manufacturing in mainland China. There is also an emphasis on the Chinese market. However, China is still dominated by small and medium-sized manufacturing companies. There are fewer large SMT companies and the overall manufacturing quality is not high.
Huang Junrong believes that the development of emerging applications represented by smart phones, tablet computers, LED lighting, electric vehicles, and mobile internet will bring unprecedented business opportunities to manufacturers. At the same time, the trend of intelligent and miniaturized consumer electronics products has brought new challenges to the manufacturing industry. Therefore, the two major innovations in the printing process will play an important role in the miniaturized packaging of devices. Nowadays, the increase in packaging density and the reduction in device size have led to improvements in the conventional 0.6 aperture area ratio and solder transfer rate of 70%.
Dezong's Asian product manager Li Zong-en introduced the reporter: “For the 01005 small components and 0.3CSP, the area ratio of openings is 0.4, and the corresponding transfer rate of solder paste is only 30%-40%. ProActiv technology (dynamic blade) ) It helps to increase this value to more than 70%. For miniaturized devices, it is also compatible with hybrid assembly, as long as a single screen can be completed."
On the other hand, a lower stack height and a thinner wafer require the flatness of printing equipment. Li Zong-en said that the improvement of DEK's ultra-flat wafer trays and tracks can greatly enhance the flatness. In addition, the use of a wafer directly on the back of the wafer in a wafer-level package results in a 20% cost savings over a single-chip dispensing method.
Huang Junrong believes that the development of emerging applications represented by smart phones, tablet computers, LED lighting, electric vehicles, and mobile internet will bring unprecedented business opportunities to manufacturers. At the same time, the trend of intelligent and miniaturized consumer electronics products has brought new challenges to the manufacturing industry. Therefore, the two major innovations in the printing process will play an important role in the miniaturized packaging of devices. Nowadays, the increase in packaging density and the reduction in device size have led to improvements in the conventional 0.6 aperture area ratio and solder transfer rate of 70%.
Dezong's Asian product manager Li Zong-en introduced the reporter: “For the 01005 small components and 0.3CSP, the area ratio of openings is 0.4, and the corresponding transfer rate of solder paste is only 30%-40%. ProActiv technology (dynamic blade) ) It helps to increase this value to more than 70%. For miniaturized devices, it is also compatible with hybrid assembly, as long as a single screen can be completed."
On the other hand, a lower stack height and a thinner wafer require the flatness of printing equipment. Li Zong-en said that the improvement of DEK's ultra-flat wafer trays and tracks can greatly enhance the flatness. In addition, the use of a wafer directly on the back of the wafer in a wafer-level package results in a 20% cost savings over a single-chip dispensing method.
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