The advancement of technology not only promotes the development and progress of science and technology and industry, but also makes the development of the industry show stage characteristics and possesses the characteristics of the times. Review 2015, CSP, UV Â LED , quantum dot LED, graphene, silicon substrate... are all hot keywords in the development of LED industry technology in the past year.
CSP
CSP (Chip ScalePackage) is a new chip-scale package technology. The package size and chip core size are basically the same. The ratio of core area to package area is about 1:1.1. Any package that meets this standard can be called "CSP".
Maximizing the luminous flux per unit area (high optical density) and the maximum cost-to-package BOM cost (low package cost) make CSP hope to open a subversive breakthrough in lm/$, which is considered the “ultimate†package.
CSP has potential advantages in reducing costs. In addition, it has obvious advantages in other aspects. For example, in the design of luminaires , the size of the CSP package is greatly reduced, which makes the luminaire design more flexible and the structure more compact and simple. In terms of performance, due to the small light-emitting surface of CSP and high optical density characteristics, it is easy to control optical directivity. The electrode design of flip-chip is used to make the current distribution more balanced, suitable for larger current drive; the Droop effect is slowed down and reduced. The light absorption allows the CSP to have room for further improvement in light efficiency. In terms of process, sapphire increases the distance between the phosphor and the MQW region of the chip, the phosphor temperature is lower, and the white light conversion efficiency is also higher.
Therefore, CSP is expected by the industry, and even in the industry, "CSP technology will sooner or later have to change the life of the packaging factory, but the time has not yet arrived."
In this regard, some insiders said that the emergence of technology, whether it is the "opposition" questioning, or the "supporting faction" is strong, CSP technology products have indeed come out and listed. Although it currently faces problems such as low light efficiency, difficult soldering, and uniform color and light, its small luminous area, high optical density, uniform color, small size, increased application flexibility, and low potential for cost reduction also seem to indicate CSP. Technology will be the future development trend of LED packaging. "We must not only see the strengths of new technologies, but also see some shortcomings to make up for it. Controversy and deficiencies can better promote the application and development of CSP technology. For the future, whether it is the life of the packaging factory, It will take time to verify."
UV LED
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Work Light
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