[Text/High-tech LED reporter Gao Jinyu] On November 25th, 2013 Gaogong LED Lighting Exhibition was grandly opened at Guangzhou Poly World Trade Expo Center. Dazu Optoelectronics took the 2013 model high-speed automatic SMD gold wire bonding machine to attend the 2013 Senior Engineers. LED lighting exhibition.
"This year's sales have increased by 30% over the past year, but they have been relatively light in the next half year. They are all digesting the inventory in the first half of the year." He Yunbo, general manager of Han's optoelectronics, said that the LED industry is full of irrational investments, and terminal demand is not like everyone. As expected, it will grow substantially.
As equipment manufacturers' profits have been declining year after year, packaging equipment manufacturers have focused on the speed and capacity of equipment, and now pay more attention to the comprehensive performance of equipment, especially in terms of equipment accuracy, stability and reliability, and this reflects the LED packaging industry. There is a certain rational return.
He Yunbo introduced that the four main packaging equipments of Dazu Optoelectronics are wire bonding machines, solid crystal machines, beam splitters and tape machines. Among them, the wire bonding machine is the product that Dazu Optoelectronics introduced to the market at the latest, and has now become the leading product of the company.
The wire bonding machine is the most important part of the whole packaging process, and the technical difficulties are many, which can best reflect the competitive advantage of the enterprise. Among the latest products that Dazu Optoelectronics pushes this year, the high-speed automatic SMD gold wire bonding machine is the most complicated and technically difficult.
He Yunbo said that the HANS5201 fully automatic SMD wire bonding machine of Dazu Optoelectronics is close to the international level while ensuring the welding precision and the mass production reliability. In addition, the high-speed automatic in-line wire bonding machine HANS5110 independently developed by Dazu Optoelectronics has even surpassed the latest models of similar international products.
"This year's sales have increased by 30% over the past year, but they have been relatively light in the next half year. They are all digesting the inventory in the first half of the year." He Yunbo, general manager of Han's optoelectronics, said that the LED industry is full of irrational investments, and terminal demand is not like everyone. As expected, it will grow substantially.
As equipment manufacturers' profits have been declining year after year, packaging equipment manufacturers have focused on the speed and capacity of equipment, and now pay more attention to the comprehensive performance of equipment, especially in terms of equipment accuracy, stability and reliability, and this reflects the LED packaging industry. There is a certain rational return.
He Yunbo introduced that the four main packaging equipments of Dazu Optoelectronics are wire bonding machines, solid crystal machines, beam splitters and tape machines. Among them, the wire bonding machine is the product that Dazu Optoelectronics introduced to the market at the latest, and has now become the leading product of the company.
The wire bonding machine is the most important part of the whole packaging process, and the technical difficulties are many, which can best reflect the competitive advantage of the enterprise. Among the latest products that Dazu Optoelectronics pushes this year, the high-speed automatic SMD gold wire bonding machine is the most complicated and technically difficult.
He Yunbo said that the HANS5201 fully automatic SMD wire bonding machine of Dazu Optoelectronics is close to the international level while ensuring the welding precision and the mass production reliability. In addition, the high-speed automatic in-line wire bonding machine HANS5110 independently developed by Dazu Optoelectronics has even surpassed the latest models of similar international products.
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