The characteristics of CSP determine that it is impossible to completely replace traditional SMD in general lighting applications in the next five years, but it does not prevent enterprises from accelerating CSP product development and marketing efforts.
Recently, Samsung LED has introduced a CSP LED module with color adjustability and increased compatibility modules. These modules will be mainly used in LED spotlights and downlights. This is Samsung's official launch of the first generation of CSP in 2014, is constantly accelerating the development speed of CSP new products.
At the Frankfurt show earlier this year, Samsung Electronics Vice President Tan Changlin revealed that Samsung's CSP LED series products now offer a full range of CSP LEDs from low power, medium power, high power and even array modules. Some CSP specifications can be as high as 160 LM/W. At the same time, it is mentioned that the CSP LED of GaN on Si will be mass-produced by the end of 2016. There will be a better Lm/$.
Today, in the face of fierce price competition in traditional packaging products, foreign large companies represented by Samsung and Osram are working in two directions. First, new packaging technology and technology upgrades such as CSP, and second, new sub-application areas, including new applications in automotive headlights, infrared, ultraviolet, projection and VR.
Backlight CSP head array effect appears
The emergence of new LED light source technologies has always started with other applications such as backlighting. Since the backlight has relatively low price sensitivity to LED devices and requires high performance indexes such as energy consumption and color, it has always been a test field for new LED technologies.
Industry insiders pointed out that the price of CSP products is still at a relatively high price relative to lighting applications, and many companies have failed to achieve mass production, but the market for LED backlights and mobile flashlights has been growing.
Recently, Jingyuan Optoelectronics revealed that based on the rapid growth of TV backlight demand for CSP, it will increase the existing CSP by about 4 times capacity in early 2017. At present, Jingdian has about 30% of global CSP shipments. In addition, CSP-based QD quantum dot chips will also be available for 60-70-inch LCD TVs early next year.
According to the relevant person in charge of Guoxing Optoelectronics, the CSP is not obvious for the mature medium-power SMD, whether it is light efficiency or cost performance. At present, the cost competitiveness is weak, and the cost of the front-end equipment brought by the process disruption will take some time. digestion.
Most of the CSP is based on flip chip, and the yield of flip chip has not yet reached the effect of the packaged chip. At the same time, there are not enough companies producing CSP, the scale effect is not obvious, and the cost has not been reduced to the popularization range.
According to the internal staff of Dehao Runda, “Our backlight products market is becoming more mature, and we continue to promote outdoor lighting, industrial lighting and commercial lighting solutions, and we produce CSP white LED package (minimum 0.9x0.5mm), super Low thermal resistance (less than 0.9 ° C / W), cost-effective advantages."
Toshiba Japan introduced a white chip-scale packaged LED (CSP-LED) measuring only 0.65mm × 0.65mm last year, claiming to be the industry's smallest. Nichia's FCCSP production line is expected to reach tens of millions of initial capacity per month from October this year, with the goal of bringing flip-chip packages to the mainstream market position in the next 3-5 years.
The person in charge of Jingdian said, “Many technical issues about CSP have been resolved this year, which has also led to a rapid increase in demand for CSP LEDs.â€
According to the latest data from GGII, as of the end of the third quarter, the monthly shipment of global CSP LEDs has increased from 5 million at the beginning of this year to 230 million, which means that the market demand is rising.
“With the continuous improvement of CSP light efficiency and the continuous maturity of yield and technology, the cost reduction of CSP for lighting in the first half of this year is inevitable,†said Wang Gaoyang, deputy general manager of Hongli Optoelectronics.
Can modularization open up barriers to application?
At this stage, CSP has increased its market share in LED backlight and mobile phone flash, but it is rarely used in the lighting market. Traditional placement equipment can not meet the fine requirements of CSP small-size chips, making some traditional lighting assembly plants to CSP. The acceptance is not high.
According to the disclosure information of Samsung LED, the CSP module launched this time is Samsung's first introduction of CSP technology into module products, thus playing more features of CSP itself. In particular, the combination of flip chip and phosphor coating technology has reduced the use of traditional metal wires and brackets to achieve a more compact design process.
CSP packaging has always had its own technical barriers, such as: CSP product size is small, mechanical strength is inherently insufficient, material sorting test process is difficult, SMT placement technology requirements are higher. Therefore, the application of CSP free packaging to luminaire manufacturers is a new topic, and many problems remain to be solved.
CSP can make the package simple. Therefore, the packaging company must constantly innovate and adjust, make full use of its mid-stream advantage, and find its own value in the extension of both upstream and downstream. And provide solutions and added value for downstream customers in modular, functional, and intelligent LED applications.
From the perspective of lighting companies, existing patch devices cannot meet the accuracy requirements of CSP, and the accuracy of the die placement and alignment machine is required.
According to insiders of Guoxing Optoelectronics, the company's NS-CSP series uses exclusive patented ceramic film substrate technology (C-TFS) to recrystallize flip-chips on ultra-thin precision ceramic films, using ceramics with high strength and low expansion. The coefficient characteristic buffers the epitaxial layer of the chip and the external circuit to achieve high reliability operation of the CSP device.
"CSP technology will bring about a revolution in module technology and solve a lot of costs for users." Chen Kai, general manager of Maple Yongming stressed.
One of the biggest obstacles to the popularity of CSP in the past is the inconsistency of product specifications. The rapid start-up of traditional SMD products such as 2835 is due to the standardization of size.
Liu Guoxu, executive vice president of Yimeixinguang, said: "There is currently no standard for the development of CSP. The size of everyone is not the same as that of medium power 2835, 4014, 5630. If a standard is formed, its promotion will accelerate. It may take some time for the lighting to use the CSP."
Wang Cuiyang, general manager of Hongli Optoelectronics, said, “CSP packaging technology faces many technical difficulties, including the difficulty of packaging process, how to choose the process, how to optimize the difference of different process performance, the size of CSP products is diversified. How to achieve a standardized promotion, whether there are a series of problems such as more breakthrough processes."
“Because the same standard LED module can be selected by many manufacturers at the same time, the standardized LED module products can also be easily mass-produced,†said an industry source.
Since the LED module clearly defines the output lumens, color rendering index, system luminous efficiency, color temperature continuity and viewing angle width of different applications, it has greatly improved and effectively guaranteed the application quality of the LED lamps.
Wang Mengyuan, general manager of Zhonghao Optoelectronics, said that the package should not be viewed from a stand-alone perspective. It should be regarded as a monolithic one, that is, the package needs to cooperate with the chip factory to provide the final semi-finished product or so-called downstream. The product form of the light source. "
At the same time, modular products have brought more design space and rational use of limited R&D resources to downstream luminaire manufacturers.
Samsung's CSP module also offers color-adjustable features. The traditional adjustable module requires at least two LEDs, which are responsible for high color temperature and low color temperature, so as to achieve the color temperature function.
Chen Jiang, deputy general manager of Dongpu Optoelectronics, said that in the field of general lighting, how to combine the advantages of CSP packaging, innovate in lighting design, produce differentiated products, improve product competitiveness, and meet the market's differentiated needs, is the present CSP package manufacturers and luminaire manufacturers should consider.
For example, the lighting power of 2835 and 3030, as well as the backlight power of 4014, 5630, has been accepted by the industry as a size standard. If the CSP can be standardized in chip size and appearance size and light distribution angle, it may develop faster. .
When asked by reporters, in the future, CSP will directly supply the opportunity to downstream lighting companies in the form of modules. Zhang Luhua said, “When the cost performance of CSP can compete with the mainstream of the market 2835, 3030, and the precision of the terminal lighting manufacturers on the placement technology. The degree has been greatly improved."
Half-cell Polycrystalline Solar Panel
Half-Cell Polycrystalline Solar Panel,340W Half Cell Solar Panel,High Efficiency Polycrystalline Solar Cell Panel,Half-Cell Poly Solar Panel
Jiangsu Stark New Energy Co.,Ltd , https://www.stark-newenergy.com