Because of TSMC's foundry process problems, AMD 6000 series desktop and notebook graphics cards are actually transition products after a compromise. They are still based on 40nm, and the 7000 series switched to 28nm technology is actually planned early, or it will start in early 2012. One after another debut. In terms of notebooks, after the Radeon HD 6500M/6300M ​​series was replaced with a vest model, three real new core “Blackcomb†(Blackcomb), “Whistler†(Wishler), and “Seymour†(West) Moshan) is expected to launch in the first quarter of 2011, targeting high-end, low-end markets respectively.
Then there is the 28nm 7000 series. The specific code (after New York and Vancouver moved to London), positioning, memory specifications, and performance are as follows:
- "Thames": For the entry-level and mainstream markets, the memory is 128-bit wide, with 1GB GDDR5/GDDR3, thermal design power consumption of 15-20W, twice as fast as Seymour. It is worth mentioning that, Seymour is still 64-bit memory bandwidth, Thames has doubled, it seems that in the future entry-level mobile graphics finally bid farewell to 64-bit.
- "Chelsea" (Chelsea): For the performance-class market, the memory is still 128-bit wide, with 1GB GDDR5 or 2GB GDDR3, thermal design power 20-30W, MXM 3.0 module interface performance is approximately 30% faster than Whistler.
- "Heathrow" (Heathrow): For high-end markets, there are 128-bit and 192-bit versions of the memory, which will also be the first 192-bit-wide specification on the A-card with 1.5- 3GB GDDR5, thermal design power consumption 30-45W, MXM 3.0 module interface, performance is increased by approximately 30% on the basis of Chelsea.
- "Wimbledon" (Wimbledon): For the enthusiast market, the bit width is increased to 256-bit, with 2-4GB GDDR5 (8-16 64M x 32), thermal design power consumption is more than 65W, MXM 3.0 module interface, performance Up about 25% over Blackbomb.
Thames, Chelsea, and Heathrow are scheduled to start production in the fourth quarter of 2011. The flagship Wimbledon will have to wait until the second quarter of 2012 and may release it later.
As for the time being called Mobility Radeon HD 7000 Series or Radeon HD 7000M Series, we now continue the previous version according to tradition, but since Radeon HD 6500M/6300M ​​series has already opened its head, I feel that the latter possibility should be greater. some.
Microwave PCB
microwave PCB`s is a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog applications. This allows for the effective placement of very fine pitch components including, in some cases, bare die-attach. Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.
Features
.CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
.ER = 3.38/3.48 at 10.0 GHz
.ER is constant to 40.0 GHz
.ED (electro-deposited) copper only
.Layer-to-layer thickness control = +/- 0.001
.Fabrication costs are typical to slightly increased
Microwave PCB
Microwave PCB,Microwave Frequency PCB,Bare Copper Microwave PCB,High Frequency PCB
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