The International Semiconductor Manufacturing Equipment Materials Association (SEMI) has released the latest forecast "World Fab Forecast" for investment in semiconductor production line equipment. According to the forecast, the total equipment investment of the world's semiconductor production line construction costs and manufacturing equipment import fees will increase by 22% in 2011 to reach 47.2 billion US dollars. According to SEMI, this will exceed the previous peak of 2007 by 46.4 billion US dollars, setting a new record in history.
The number of new production lines will be reduced
Among them, in terms of semiconductor production lines, there are more than 20 new production lines before 2010, and will be around 1 digit after 2011. SEMI predicts that the number of new 300mm wafer production lines will decline sharply in the next two years compared with the past 10 years. In terms of the number of new production lines, there are 7 in 2011 (including 5 for LEDs) and 4 in 2012. Among them, the number of new 300mm production lines, one in 2011 (Intel in the US), three in 2012 (two of which may support 450mm wafers). There are 7 new production lines in 2010 (including R&D production lines). In addition, SEMI revealed for the first time in this forecast that the 450mm production line (one of the R&D production line, the trial production line or the production line) has already appeared. Among them, SEMI predicted that the first production line will be completed in 2013.
Manufacturing equipment import costs will grow steadily
The cost of introducing manufacturing equipment will increase by 28% from the previous year to US$43.6 billion, showing a relatively high growth trend. At its core is the transformation and expansion of existing production lines. The reason for the higher growth is that Intel and Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) have been insisting on semiconductor equipment investment in large equipment investment in recent years, and plans to continue to increase equipment investment in 2011. Specifically, Intel will increase its 2010 investment of $5.2 billion in equipment to $8.7-9.3 billion in 2011. Similarly, TSMC will increase from 5.9 billion US dollars to 7.8 billion US dollars, and US GLOBALFOUNDRIES will increase from 2.7 billion US dollars to 5.4 billion US dollars. In addition, South Korea's Samsung Electronics will reduce equipment investment from $11.3 billion in 2010 to $9.2 billion in 2011, and even maintain a high level of equipment investment.
Wafer processing capacity growth rate of 5% to 9%
SEMI believes that in view of the above equipment investment situation, wafer processing capabilities (excluding discrete semiconductor devices) after 2011 will increase smoothly by 5% to 9%. In other words, the wafer processing capacity in 2011 will increase by 9% over the previous year, and will increase by 7% from the previous year from 2012 to 2014.
The number of new production lines will be reduced
Among them, in terms of semiconductor production lines, there are more than 20 new production lines before 2010, and will be around 1 digit after 2011. SEMI predicts that the number of new 300mm wafer production lines will decline sharply in the next two years compared with the past 10 years. In terms of the number of new production lines, there are 7 in 2011 (including 5 for LEDs) and 4 in 2012. Among them, the number of new 300mm production lines, one in 2011 (Intel in the US), three in 2012 (two of which may support 450mm wafers). There are 7 new production lines in 2010 (including R&D production lines). In addition, SEMI revealed for the first time in this forecast that the 450mm production line (one of the R&D production line, the trial production line or the production line) has already appeared. Among them, SEMI predicted that the first production line will be completed in 2013.
Manufacturing equipment import costs will grow steadily
The cost of introducing manufacturing equipment will increase by 28% from the previous year to US$43.6 billion, showing a relatively high growth trend. At its core is the transformation and expansion of existing production lines. The reason for the higher growth is that Intel and Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) have been insisting on semiconductor equipment investment in large equipment investment in recent years, and plans to continue to increase equipment investment in 2011. Specifically, Intel will increase its 2010 investment of $5.2 billion in equipment to $8.7-9.3 billion in 2011. Similarly, TSMC will increase from 5.9 billion US dollars to 7.8 billion US dollars, and US GLOBALFOUNDRIES will increase from 2.7 billion US dollars to 5.4 billion US dollars. In addition, South Korea's Samsung Electronics will reduce equipment investment from $11.3 billion in 2010 to $9.2 billion in 2011, and even maintain a high level of equipment investment.
Wafer processing capacity growth rate of 5% to 9%
SEMI believes that in view of the above equipment investment situation, wafer processing capabilities (excluding discrete semiconductor devices) after 2011 will increase smoothly by 5% to 9%. In other words, the wafer processing capacity in 2011 will increase by 9% over the previous year, and will increase by 7% from the previous year from 2012 to 2014.
new LED Street Light, housing from PC COOLER-- China's most famous housing manufacturer. new LED Street Lights have good heatsink, Ultra-thin ultra-small size, to save shipping for customers, high lumens and long lifespan. 10KV Surge Protection. high color rendering index of the unique advantages of urban lighting energy conservation is of great significance. We can provide 20w-300w different watts LED Street Lights for sale to meet your needs to meet your needs
new LED Street Light,LED Street Light Fixtures,Solar LED Street Light,LED Street Light
Shenzhen Ri Yue Guang Hua Technology Co., Ltd. , http://www.ledlightinside.com