Wafer foundry is now the second-line plant bear the brunt of a single reduction

Although foreign chip suppliers presented quarterly purchase orders and adding orders from the third quarter of 2010 to the first quarter of 2011, the North American IC design industry’s latest quarterly earnings report showed that the inventory level was rising quarter by quarter. IC design companies It is pointed out that once the end-users show signs of slowing demand, or the visibility of the economy is becoming increasingly blurred, foreign chip suppliers are bound to join the deduction order. The first foundry foundry will definitely not be TSMC, but other second-tier plants in the world. After advanced shipments of wafers in the first quarter, whether this wave of high-intensity wildfires will be extended upwards to TSMC depends on whether the market demand in the mainland and emerging countries can recover and effectively reduce inventory.

According to the IC design industry, the history of Taiwan's foundry industry growth has been viewed as whether the economy has risen from the bottom and whether TSMC's capacity utilization rate has started to rise upwards in order to determine whether or not the economy is beginning to reverse its head. In turn, it depends on whether the second-tier wafer foundry's capacity utilization rate begins to slip. Therefore, looking at Taiwan Semiconductor Manufacturing Co., Ltd. at the bottom of the boom and reversing the boom head to see second-tier wafer fabs has become an important key for Taiwan's semiconductor industry to judge whether the economy is up or down.

IC design industry pointed out that because domestic and foreign chip suppliers will no longer cut orders, they will eventually cut orders for TSMC, because TSMC's bargaining power and bargaining power (Bargain Power) is much larger than that of any chip supplier. Therefore, if it is not absolutely necessary, in order to maintain the long-term partnership, the chip suppliers will not arbitrarily move their orders to TSMC before the 1st quarter.

This time, the world's advanced wafers shipments in the first quarter of the first quarter have been reduced from 30% to 20% to 22%. IC design companies believe that this is not only a world-leading negative, but also a reduction in wafer shipments. The packaging and testing industry will also follow the lead of Taiwan's IC design industry. Since wafer foundry and packaging and testing capacity are no longer tight, there may be opportunities for cost reduction. At this stage, everyone is most concerned about the global wafer generation. In the industrial market, whether or not the doubts are about to be triggered is repeated.

IC design makers frankly stated that TSMC represents a technology partner. Chip makers tamper with orders and fear the development of their own chip technology. As for other foundries, they are mostly partners for cost reduction. Once the terminal is in poor demand, it will be large for IDM. For the factory, the order to others to earn, it is better to take back to do their own, the cost is still relatively low, reduce the single becomes inevitable; and for domestic and foreign chip suppliers, anyway, TSMC orders can not be cut, the amount of orders is sufficient After supporting the end customer's needs, of course, other second-tier foundry orders must be cut.

It is worth noting that the utilization rate of Taiwanese wafer foundries in the first quarter has continued to increase in the second half of 2010. Unless the order volume in 2011 can be increased by more than 40%, customers will sooner or later take orders for temporary rest. However, despite the continued release of IDM manufacturers, it is still difficult to increase the number of OEM orders by 40% in 2011.

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