SEMICON Taiwan 2010 was on display on September 8th. DISCO from Japan exhibited a variety of new products and occupies an important position in the global semiconductor industry.
DISCO has introduced the HC System DGP8761HC for TSV packaging and has achieved high detergency for polished (CMP) wafers. For the Haze solution, additional processing axes have been added to the dedicated Pad, enabling the addition of transport parts and reduction Grinding load. The general CMP process using the slurry corresponds to the application of simultaneous grinding of Si+ electrode materials constructed by the TSV; the ultra-precision cutting process forms a high flatness Bump; improves the mounting accuracy and achieves low temperature; and can reduce the bonding failure and reduce the cost of the gold plating process.
In the LED segment, the introduction of thinning of LED sapphire substrates (DGP8761) can reduce the processing steps associated with LED manufacturing and reduce the environmental load; through a fully automated process that reduces processing steps, reduces risk of damage, and reduces environmental load . In addition, laser technology, DFL7340 has invisible cutting, the processing of the internal use of light to make it deteriorate, the use of tape expander cutting die cutting method, does not give the processing mechanical load, without the use of water Dry process.
DISCO has been a leading brand in the field of semiconductors, but it is still so dazzling to enter the LED industry. It represents the company’s technological rooting and demonstrates the quality assurance of Japanese brands. With the support of such an insistent spirit, DISCO will continue Ranked globally as a leading brand and penetrated into more diverse industries.